👉 Termination engineering is a critical aspect of semiconductor device fabrication that deals with controlling the precise removal of charge carriers (electrons or holes) from a device's active regions, such as the source, drain, and channel areas in transistors. This process is essential for optimizing device performance, particularly in terms of speed and power consumption. Termination layers, typically made of high-κ dielectrics or metal oxides, are strategically placed to prevent premature recombination of carriers at the source and drain junctions, ensuring that these carriers reach the contacts before being extracted. By carefully designing these termination layers and their interfaces, engineers can minimize leakage currents, reduce variability in device performance, and enhance the overall reliability and efficiency of semiconductor devices. This precise control over carrier removal is crucial for achieving the desired electrical characteristics in modern integrated circuits.
